Descrizione
Specifications:
Semiconductor Chilling Plate: TEC1-12706
Size: 40 * 40 * 3.75mm
Internal Resistance: 2.1~2.4Ω
Max. Temperature Difference: 67°C Above
Rated Voltage: 12V(Vmax. 15V, Starting Current 5.8A)
Working Current: Imax.=4~4.6A(Rated 12V)
Refrigeration Power: Max. 50~60W
Working Environment: -55~83°C
Sealing Process: Standard 704 silicon rubber sealing all sides
Fan: DC 12V
Large Fan Size: 90 * 90 * 25mm
Small Fan Size: 40 * 40 * 10mm
Conduction Module Size: 60 * 45 * 21mm
Radiator Size: 116 * 100 * 23mm
Package Size: 19.5 * 13 * 5.5cm / 7.67 * 5.12 * 2.16in
Package Weight: 468g / 16.53oz
Package included:
1 * TEC1-12706
2 * Fans(Large and Small)
1 * Radiator
1 * Outer Cover for Fan
1 * Conduction Module
1 * Thermal Grease
1 * Thermal Insulation Gasket
1 * Pack of Screws
Note:
1. The conduction cool module can frost when the temperature is under -25°C.
2. TEC1-12706: one side with words is the refrigeration side, the other side is heat dissipation side.
3. Must install heat sink or water-cooled radiator on the heat dissipation side; otherwise will burn the Peltier.
4. The DC power is not included in this kit, please prepare it by yourself.
➤ ♬ Adottare la piastra di raffreddamento a semiconduttore TEC1-12706, buona qualità per l’uso.
➤ ♬ Completa la struttura sigillata, isolando l’umidità nell’aria.
➤ ♬ Maggiore affidabilità rispetto ad altri.
➤ ♬ Include dispositivo di raffreddamento a semiconduttore TEC1-12706, 2 ventole e altri accessori, facile da installare.
➤ ♬ Ottimo kit fai-da-te per gli appassionati di elettronica nelle applicazioni di raffreddamento a semiconduttore.
